ASML PAS 5500/200 Stepper – Resolution ~350 nm, suitable for 150 mm diameter silicon/glass wafers of thickness ~300 or greater. 6” x 6” quartz masks (5x feature size). Layer to layer overlay better than 50 nm. Variable NA from 0.48 – 0.60. Conventional or annular illumination, I-line (365 nm) wavelength. 22mm x 22mm field size.
GCA 5x Reduction Stepper – Resolution <2 µm, suitable for 50, 100 & 150 mm diameter silicon/glass wafers with thickness 100 µm or greater. 5” x 5” soda lime glass masks (5x feature size). Fixed NA 0.28. G-line (436 nm) wavelength. 20mm x 20mm field size.
Suss MA150 Aligner – Contact aligner capable of ~10µm resolution. Suitable for 100 & 150 mm diameter silicon/glass wafers. 5” x 5” to 7” x 7” masks (1x feature size). Broadband or I-line illumination. Front-to-back alignment of 100 mm wafers with less than 5 µm offset.
Resist Coaters – Both automated and manual spinners. Spin speeds of 500-5000 rpm, multi step programs. In house resists: Fuji Film OiR620, Shipply S1813, Shipply S1827, Protek B3. Also capable of a wide range of positive, negative and ARC resists and coatings to suit your needs. Automated coating of 150 mm wafers, manual coating of most substrate types and diameters up to 150 mm. Equipment: SSI wafer track, CEE 100 manual spincoater, SCS 6700 manual spincoater.