Physical Vapor Deposition
AJA ATC 2000-V – RF/DC sputter-up system capable of thin-film non-uniformity <1%. 600W RF max power or 300W DC max power, 3in targets, DC biased (50W(max)) and heated (600˚ (max)) chuck. Materials: SiO2 and Si (undoped), others available on a per customer basis. Suitable for 100 & 150 mm silicon or SiO2 substrates.
CVC 601 – DC sputter-up system 8in targets. Materials: Al, Ti, Mo, and ITO. Suitable for most substrates 100 & 150 mm in diameter.
PE2400A/PE4400 – RF sputter-down systems 8in targets sputter etch for pre-cleaning. Materials: Al, Ni, Ti, Ta, and SiO2. Suitable for most substrates and sizes.
CHA E-beam Evaporator – Eight position electron beam evaporator. Materials: Si, SiO2, Au, Ti, Cr, Al, Al2O3, Pd, and Mo, others possible. Suitable for most substrates and sizes, both rotating and stationary substrate mounting.
CHA Flash Evaporator – Flash evaporation of Aluminum wire. Suitable for most substrates 100 & 150 mm in diameter, both rotating and stationary (adjustable tilt) substrate mounting.
CVC Thermal Evaporator – Four position thermal stage for evaporation boats or tungsten wire baskets. Ideal for non-conformal coatings/lift-off. Materials: Au, Ti, Cr, Al, and Cu, others possible. Suitable for most substrates and sizes, stationary substrate mounting with variable tilt.
Nanomaster NSC 2000 – Sputter down system for 2in targets. Setup for Zinc depositions with a rotating platen. Suitable for substrates up to 150 mm.